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       COLLOQUIUM OF THE LABORATORY FOR COMPUTER DESIGN OF MATERIALS
           Institute for Computational Sciences and Informatics
				  CSI 929
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A Coupled Plasma/Solid Method: A Tool for Modeling the Interaction of 
                        Particulates with Solids

			     Michael J. Bear
      Institute for Computational Sciences and Informatics

  The current state of semiconductor device manufacturing has advanced 
to the point of being able to produce 256Mbit and 1Gbit chips. This advanced
manufacturing capability has outpaced the ability to model new processes, and
many manufacturing lines develop new processes through trial and error. With
processed wafers costing thousands of dollars, this is a very expensive 
development method. 
  The modeling tool under development at GMU is designed to aid process 
engineers simulate the plasma reactor and resulting effects on the solid.
One of the most important parts of this tool is its ability to simulate
the interaction of the plasma with the solid. The particles, which 
interact with the plasma, span a large range of energies and materials. 
When fully finished, this new tool will be able to statistically model 
sputtering, implantation, etching, deposition, and reflection mechanisms. 
An overview of the tool's capabilities will be discussed.

                      Monday , April 21, 1997
                               4:30 pm
                      Room 206, Science & Tech. I
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